By Charles Hamilton
Read or Download A Guide to Printed Circuit Board Design PDF
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Additional info for A Guide to Printed Circuit Board Design
27 mm away from the conductor or plane area. Component side resist master The component side resist (ink) screen process is required on the component side of the board primarily to give insulation protection against short-circuits occurring between components and component side conductors and/or ground plane areas. The component side resist master artwork is produced in the same manner as used for the solder side resist master artwork, except that the solder side conductor pattern artwork must first be reversed.
Again, the PCB designer must liaise effectively with the production engineering department as the design layout progresses to ensure that the PCB will be compatible with the production method(s) used. Consultation with production engineering must never be left until the design layout is completed. This will only lead to inevitable changes which will be difficult to incorporate at a late stage in the development of the PCB. ) (11) RF considerations. With RF circuitry, extra care must be taken with the design layout.
The next step is the preparation of the master artworks for the first prototype of the PCB. 4 Preparing t h e master a r t w o r k s With the design layout completed and approved, we can now move directly to creating the master artwork(s) for the board concerned. Time is an important factor here (the engineer will almost certainly require a board in the shortest time possible from approving the layout) and therefore the PCB designer will probably move directly to creating manually taped master artwork(s) to cater for the prototype stages in the board's development, on the grounds that taped artworks are quicker to generate and easier to modify.
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